PLANARIZATION OF MICROELECTRONIC STRUCTURES BY USING POLYIMIDES

Ladislav Matay - Róbert Andok

   In the recent years there has been an increasing demand for new types of polyimides which could planarize topographies of microelectronic structures by conserving all of their electro-physical properties for a given application. In this work, planarization properties have been examined for the PPID polyimide material. Profilometer technique has been used to measure step height changes of isolated lines of various dimensions. A model of local and global planarization has been completed. Thermogravimetric analysis (TGA) has been used to evaluate thermal processes in the PPID polyimide.

Keywords: polyimides, planarization, degree of planarization, RIE, application

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