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[07-08, 1998] 

Journal of Electrical Engineering, Vol 49, 07-08 (1998) 194-199

TECHNOLOGICAL ASPECTS OF NON-ALLOYED Ti/Au CONTACTS TO InP

Václav Malina - Lorenza Moro - Béla Pécz

   An attempt has been made to summarize the effect of basic technological factors (InP surface cleaning, deposition method, post-deposition annealing) on the electrical and metallurgical properties of non-alloyed Ti/Au contacts to moderately doped n- and p-type InP. Surface treatment of InP prior to metal deposition proved to be the crucial step in contact technology, while the used deposition techniques were found to have a minor influence on the resulting electrical properties of contacts. SNMS and XTEM measurements showed that the studied Au/Ti/InP contact system ceased to be metallurgically stable when annealed at temperatures higher than 400-420oC.

Keywords: InP substrates, non-alloyed Ti/Au contacts, surface cleaning, deposition techniques, post-deposition annealing, contact properties


[full-paper]


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