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[09-10, 2004] 

Journal of Electrical Engineering, Vol 55, 09-10 (2004) 265-268

LTCC BASED TECHNOLOGY FOR 3D FORMED MODULES

Stanislav Slosarčík - Ján Urbančík - Alena Pietriková - Juraj Banský - Reinhard Bauer

   This paper is oriented on the overview of possibilities which are given by LTCC based materials. The accent was oriented to the three-dimensional (3D) electronic modules, their electrical and mechanical properties and their possible influence to the quality and reliability of final product. The authors present selected results of their research work at TU FEI, Department of Technologies in Electronics.

Keywords: thick film, LTCC, 3D formed modules


[full-paper]


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