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[11-12, 2001] 

Journal of Electrical Engineering, Vol 52, 11-12 (2001) 372-375

METHOD OF MEASUREMENT OF THERMAL CONDUCTIVITY OF RESISTIVE LAYERS IN THICK-FILM STRUCTURE

Wlodzimierz Kalita - Mariusz Weglarski - Stanislav Slosarčík

   Resistive layers are usually the main heat sources in thick-film structures. For accurate analysis of stationary and non-stationary temperature fields in structures of this kind it is necessary to know the thermal conductivity of resistive layers printed on the ceramic substrate. An unconventional method of measurement of the thermal conductivity of the resistive layer and transient region between the layer and substrate has been described. The results of measurements of the conductivity with the use of scanning electron microscopy for identification of the transient region and X-ray diffraction for measurement of temperature into the substrate have been presented.

Keywords: hybrid microcircuits, thermal conductivity, thick-film resistor, simulation of temperature states


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