ANISOTROPIC CONDUCTIVE JOINTS UTILIZATION FOR JOINING OF FLEXIBLE CABLES AT RIGID SUBSTRATES

Slavomír Kardoš - Miloš Somora - Stanislav Slosarčík - Ján Urbančík - Igor Vehec

   Key motivation of this work is the industrial task of standard lead based solders joints elimination in electronics, which comes out from the European Council requirement to exclude lead from the soldering process before the middle of 2006. The main emphasis was laid on the new approaches in tasks solving by using standard electrotechnologies and available production facilities. Results of this work were based on two types of anisotropic interconnections usability as an alternative of soldered joints in the production process, which is generally used for a reflow of the standard SnPb solder between the contact areas. Practical results of the performed study indicate that realized joints with applied anisotropic conductive adhesive have comparable electrical resistance with soldered interconnections. The lower mechanical strength is less relevant with concerning of operating conditions. The anisotropic conductive paste application demonstrates their suitability for copper-to-gold plated contacts conductive joining; however, adhesive joints realized by an anisotropic conductive tape were not satisfactory.

Keywords: anisotropic conductive adhesive, anisotropic conductive joints

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