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[1, 2018] 

Journal of Electrical Engineering, Vol 69, 1 (2018) 72-78 DOI: 10.1515/jee-2018-0010

A fast and simple bonding method for low cost microfluidic chip fabrication

Zhifu Yin – Helin Zou

   With the development of the microstructure fabrication technique, microfluidic chips are widely used in biological and medical researchers. Future advances in their commercial applications depend on the mass bonding of microfluidic chip. In this study we are presenting a simple, low cost and fast way of bonding microfluidic chips at room temperature. The influence of the bonding pressure on the deformation of the microchannel and adhesive tape was analyzed by numerical simulation. By this method, the microfluidic chip can be fully sealed at low temperature and pressure without using any equipment. The dye water and gas leakage test indicated that the microfluidic chip can be bonded without leakage or block and its bonding strength can up to 0.84 MPa.

Keywords: microfluidic chip, tape assist bonding, numerical simulation


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