APPLICATION OF ELECTROPLATING FOR DEVICE PROCESSING

Jaroslava Škriniarová - Ján Jakabovič - Ivan Kostič

   This paper presents the development in the technology of air-bridge formation for optoelectronic devices. We have introduced a double patternable planarizing lithography process for resists AZ 4560 and AZ 5214E that adds three dimensionality into the standard optical lithography. This technology offers low parasitic interconnect capacitances and inductances in devices. This method allows to define air bridges with different vertical width from 2μm up to 12μm.

Keywords: electroplating, bridge interconnects

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