OPTIMUM VIAS DISTRIBUTION TO A PRINTED CIRCUIT BOARDS
Nowadays because of impressive development of power electronic components and integrated circuits there is a high density of active electronic components on printed circuit boards (PCB). This also had involved new aspects as regards the thermal power management at the contact between the power semiconductor case and the printed circuit board. So, a multi-layers PCB and vias solution have been adopted to improve the thermal exchange between the power components and environment. At a given density of active electronic components it is important to achieve an optimum vias distribution on the PCB. 3D thermal simulations have been used in order to analyze the vias distribution and its geometry on the basis of the thermal resistance principle.
Keywords: printed circuit board, vias distribution, thermal analysi