advanced
Journal Information
Journal Information
   Description
   Editorial Board
   Guide for Authors
   Ordering

Contents Services
Contents Services
   Regular Issues
   Special Issues
   Authors Index

Links
Links
   FEI STU Bratislava
   SAS Bratislava

   Feedback

[6, 2013] 

Journal of Electrical Engineering, Vol 64, 6 (2013) 361-365 DOI: 10.2478/jee-2013-0054

MECHANICAL BEHAVIOR AND THERMAL STABILITY OF EVA ENCAPSULANT MATERIAL USED IN PHOTOVOLTAIC MODULES

Radek Polanský – Martina Pinkerová – Monika Bartůňková – Pavel Prosr

   The mechanical behavior and the thermal stability of an encapsulant based on ethylene-vinyl acetate (EVA) were studied. The EVA properties were verified at temperatures ranging from -70°C to 500°C. Thermogravimetry, differential scanning calorimetry and dynamic mechanical analysis were used in this study. It has been shown that the encapsulant has a good weight stability; however, the encapsulant passes through both a glass transition and a melting phase in the range of operating temperatures. The kinetic parameters of crosslinking were also analyzed. It is possible to achieve 65 % crosslinking at a temperature of 150°C and a time of 5 minutes. The activation energy of crosslinking is 95.6 kJ/mol.

Keywords: renewable energy resources, photovoltaic, EVA, encapsulant, glass transition, thermal analysis


[full-paper]


© 1997-2019  FEI STU Bratislava