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[6, 2014] 

Journal of Electrical Engineering, Vol 65, 6 (2014) 381-385, DOI: 10.2478/jee-2014-0062

ELECTRON BEAM LITHOGRAPHY DOUBLE STEP EXPOSURE TECHNIQUE FOR FABRICATION OF MUSHROOM-LIKE PROFILE IN BILAYER RESIST SYSTEM

Kornelia Indykiewicz – Bogdan Paszkiewicz – Tomasz Szymański – Regina Paszkiewicz

   The Hi/Lo bilayer resist system exposure in e-beam lithography (EBL) process, intended for mushroom-like profile fabrication, was studied. Different exposure parameters and theirs influence on the resist layers were simulated in CASINO software and the obtained results were compared with the experimental data. The AFM technique was used for the estimation of the e-beam penetration depth in the resist stack. Performed numerical and experimental results allow us to establish the useful ranges of the exposure parameters.

Keywords: T-shape resist profile, mushroom-like resist profile, bilayer resist system, resist exposure model, MC simulations, e-beam lithography, double step exposure


[full-paper]


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